: Requires continued performance and extended life; uninterrupted service is desired but not critical.
, officially titled Requirements for Solder Paste Printing , is the industry-standard guide for evaluating the visual quality of solder paste deposits immediately after the printing process. Unlike other standards that focus on finished solder joints, IPC-7527 provides the essential "upstream" criteria needed to catch 60–70% of surface mount defects before they reach expensive reflow stages. Core Purpose and Scope ipc-7527 pdf
Released in May 2012, the standard consists of roughly 23 pages of detailed criteria and photographic examples. It follows the standard IPC three-class system: ipc-7527 pdf
: Often seen in specific types of paste or print speeds. ipc-7527 pdf